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Introduction
CEO Message
Introduction
Philosophy
Company History
Location
Products
Products
R&D Introduce
R&D Introduce
R&D Organization
R&D Achievements
R&D Equipment
PR Center
Innovation
Catalogue
PR Video
Welfare
Welfare
Products
Products of NR G&C
PRODUCT
Products
Half Etching Solution
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Stripping Solution
Flash Etching Solution
Plating Solution
Soft Etching Solution
Half Etching Solution
Degreasing Agent
Antifoaming Agent
Developing Solution
Chamber Cleaner-1
Chamber Cleaner-2
Green Chem Leader of Naret
Development of our own technology and production system
Half Etching Solution
APPLICATION
Half Etching(20µm, 9.0µm, 6.0µm, 3.0µm)
Fine pattern process (30µm, 40µm, 50µm)
When copper foil thickness needs to be uniform and thin with a certain thickness
FEATURES
Soft and uniform copper foil can be formed by adding a small amount
Excellent in removing oxide films
Easy to treat its wastewater due to sulfuric acid and hydrogen peroxide type
DEVIATION GRAPH OF HALF ETCHING
Deviation measurement graph during 6 µm etching
Deviation measurement graph during 10 µm etching
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