PRODUCT
Products
Green Chem Leader of Naret
Development of our own technology and production system
Plating Solution
| APPLICATION |
- SAP/MSAP/Flexible/RF/HDI
- Desmear (hole/surface chemical)
- Non-electrolyte chemical copper plating
- Chemical copper plating solution for Flexible/Rigid-Flex/MSAP
- Electrolyte copper degreasing agent for Flexible/Rigid-Flex/MSAP
|
| FEATURES |
- Specialized hole/surface treatment (carrier copper foil/pattern circuit residue)
- Superior plating coverage (Ionic Pd)
- Excellent adhesion to PI, no plating blister
- Outstanding reliability of high-end specifications
- No circuit pattern damage
- Excellent surface tension
|
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