Development of various surface treatment processes
Process development of the best process
Chemical analysis
Property analysis
Eco-friendly development
New business research
Import inspection
Shipment inspection
2030 - 2021
2030
2021
2026
- Development of Non-E/T-Type Dedicated Stripper for Masking Processes
- Relocation to the New Yongin Central Research Center
2025
- Development of Non-E/T-Type Chemical Bonding Technology
- Development of PR Cleaner
2024
- Development of Chlorate-Type Etching Additive NEA-01
- Development of Bacterial Cleaner
- Development of CZ Pre-Treatment Degreaser
2023
- Development of De0flux Cleaner
- Development of TGV Ti/Cu Etchant
- Development of PR Stripper
2022
- Development of Etching Additive NIE-30
- Development of Chemical Bonding Technology for Organic Film Coating
2021
- Development of Etching Additive NIE-20
- Development of Invar Mask Etchant
2020 - 2011
2020
2011
2020
- Designation as an ECRC Excellent Research Institute
- Development of Fine-Pitch SAP Etchant EFP-5
- Development of an Industrial Cleaner as an Alternative to DMC
2019
Development of additive-type developer cleaning agent
Development for desmear chemical
2018
Development of deflux cleaner
Development of mold release agent
Applied for a patent for metal cleaner and metal cleaning method
2017
Development of eco-friendly metal cleaner
2016
Development of PSR organic acid etching solution
Development of metal cleaner
2015
Development of heavy resist stripping/developing solution
Development of low etching solution under 0.3 μm
2014
Development of Non-etching type stripping solution
2013
Development of OCA/OCR resin remover RV series
Development of high-performance degreasing solution
2012
Development of Equipment cleaner
Development of MSAP FE Series
2011
Expansion of the 2nd technology research center
Patent application for etching solution and stripping solution
2010 - 1998
2010
1998
2010
Expansion of the 2nd production plant and the technical research center
Development of Amine-based stripping solution NRS Series
2008
Foundation of the research center
2007
Development of Ni, Sn, Ai etchant
Development of etchant additive for high density wiring
Acquired ISO 14001
2006
Development of Semi Additive Process Etching Solution
Acquired ISO 9001
2004
Development of Half Etching Solution
2003
Development of stripping solution for fine pattern
2002
Development of high-performance equipment cleaner
2000
Development of Antifoamer for PCB
1998
Localization of Pretreatment Chemical for PCB